Fast Physics-Based Via and Trace Models for Signal and Power Integrity Co-analysis

Author

Xiaoxiong Gu
Renato Rimolo-Donadio
Zhenwei Yu
Francesco De Paulis
Young H. Kwark
Matteo Cocchini
Mark B. Ritter
Bruce Archambeault, Missouri University of Science and TechnologyFollow
Albert E. Ruehli, Missouri University of Science and TechnologyFollow
Jun Fan, Missouri University of Science and TechnologyFollow
Christian Schuster

Abstract

Physics-Based models for vias and traces including new component models are applied to simulate multilayer interconnects on printed circuit boards. a variety of interconnect structures, including via arrays and differential links between package via fields, are studied with model-to-hardware correlation. These models also enable efficient signal integrity and power integrity co-analysis with focus on modeling simultaneous switching noise coupled into high-speed signal nets as well as understanding the effects of decoupling capacitor placement. Simulation time has been reduced at least three orders of magnitude with respect to comparable full-wave simulations.

Recommended Citation

X. Gu and R. Rimolo-Donadio and Z. Yu and F. De Paulis and Y. H. Kwark and M. Cocchini and M. B. Ritter and B. Archambeault and A. E. Ruehli and J. Fan and C. Schuster, "Fast Physics-Based Via and Trace Models for Signal and Power Integrity Co-analysis," DesignCon 2010, vol. 2, pp. 1497 - 1516, Curran Associates, Inc., Dec 2010.

Department(s)

Electrical and Computer Engineering

International Standard Book Number (ISBN)

978-161738546-9

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Curran Associates, Inc., All rights reserved.

Publication Date

01 Dec 2010