Validation and Application of Physics-Based Via Models to Dense Via Arrays

Author

Xiaoxiong Gu
Young Kwark
Yaojiang Zhang, Missouri University of Science and TechnologyFollow
Jim Fan
Albert E. Ruehli, Missouri University of Science and TechnologyFollow
Miroslav Kotzev
Sebastian Müller
Renato Rimolo-Donadio
Christian Schuster
Bruce Archambeault

Abstract

Fast and accurate via models are required to analyze dense via arrays on printed circuit boards with pitches up to 1mm. Fundamentals of physics-Based via models are reviewed and their advantages over general-purpose electromagnetic field solvers are discussed. Recent studies extend the models to take into account multiple scattering among vias. This paper also analyzes if anisotropic field distribution on via holes, and boundary reflection due to the finite size of power planes play a role for high speed digital designs. the updated via models are validated by hardware measurement and 3D full-wave simulations.

Recommended Citation

X. Gu and Y. Kwark and Y. Zhang and J. Fan and A. E. Ruehli and M. Kotzev and S. Müller and R. Rimolo-Donadio and C. Schuster and B. Archambeault, "Validation and Application of Physics-Based Via Models to Dense Via Arrays," DesignCon 2011, vol. 2, pp. 1031 - 1051, Curran Associates, Inc., Dec 2011.

Department(s)

Electrical and Computer Engineering

International Standard Book Number (ISBN)

978-161782478-4

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Curran Associates, Inc., All rights reserved.

Publication Date

01 Dec 2011