Abstract
An integral approximation method is proposed to extract the via-plate capacitance of an eccentric via in the via hole (anti-pad). an analytical formula is derived for the coaxial capacitance part, which is used as a benchmark to validate the integral approximation method. Furthermore, numerical simulations are also used to validate the method. It is shown that small eccentricity results in only a few percentages increase of the via-plate capacitance, which is helpful in specifying the manufacturing tolerance of via designs. © 2006 IEEE.
Recommended Citation
Y. Zhang et al., "Extraction of Via-plate Capacitance of an Eccentric Via by an Integral Approximation Method," IEEE Microwave and Wireless Components Letters, vol. 19, no. 5, pp. 275 - 277, article no. 4840543, Institute of Electrical and Electronics Engineers, May 2009.
The definitive version is available at https://doi.org/10.1109/LMWC.2009.2017587
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Eccentric vias; Printed circuit board (PCB); Signal integrity (SI); Via-plate capacitance
International Standard Serial Number (ISSN)
1531-1309
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 May 2009
