Abstract
In high-speed printed circuit board (PCB) designs, vias play a critical role in determining signal and power integrity. This paper uses disk resonators to investigate modeling approaches for common via array structures. Boundary integral equation (BIE) and effective dielectric medium approaches are used for a perforated disk resonator with non-plated holes, using dielectric properties derived from a solid disk resonator study. Both approaches are compared and validated with measurements. ©2009 IEEE.
Recommended Citation
A. R. Chada et al., "Model-to-hardware Correlation of Disk Resonators for Via-array Modeling in High-speed PCBs," 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp. 155 - 158, article no. 5338455, Institute of Electrical and Electronics Engineers, Dec 2009.
The definitive version is available at https://doi.org/10.1109/EPEPS.2009.5338455
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-142444447-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2009
