Abstract
Vias are typical discontinuities for high-speed signal transmission in printed circuit boards. Previous work has studied the through-hole via connections from the top layer to the bottom between microstrip traces and proposed an equivalent transmission-line model for impedance matching between traces and vias. in this paper, the equivalent transmission-line model is extended for the via structures connected to strip lines based on modal decomposition. Both single-ended and differential cases are discussed, and the effects of the model parameters on the performance of signal transition are also investigated. the extended equivalent transmission-line model is accurate and fast to be embedded in circuit simulators for via and link-path analysis. Further, it could provide straightforward criteria to design and optimize via structures for better signal integrity. ©2010 IEEE.
Recommended Citation
S. Pan et al., "Equivalent Transmission-line Model for Vias Connected to Striplines in Multilayer Print Circuit Boards," IEEE International Symposium on Electromagnetic Compatibility, pp. 455 - 460, article no. 5711318, Institute of Electrical and Electronics Engineers, Dec 2010.
The definitive version is available at https://doi.org/10.1109/ISEMC.2010.5711318
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Equivalent transmission-line model; Modal decomposition; Signal integrity; Stripline connection; Via structures
International Standard Book Number (ISBN)
978-142446305-3
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2010
