Abstract
The assumption of transverse electromagnetic (TEM) field distribution on via holes is checked by a two-dimensional (2D) finite difference method (FDM). It is found that for a via without pad, TEM mode assumption is a quite good approximation. However, for a via with a pad, i.e. the via pad radius is different from the via barrel radius, the field distribution on the via hole begins to deviate from the TEM mode. This indicates previous analytical formula for a via with pad may need to be modified at very high frequencies due to its usage of TEM field assumption on via holes. the results obtained by 2D FDM have been verified by a three-dimensional commercial electrostatic solver. © 2012 IEEE.
Recommended Citation
Y. Zhang et al., "Studies of TEM Mode Assumption on Via Holes in Via Modelings," cccc2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings, pp. 605 - 608, article no. 6237873, Institute of Electrical and Electronics Engineers, Aug 2012.
The definitive version is available at https://doi.org/10.1109/APEMC.2012.6237873
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-145771558-7
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
15 Aug 2012
