"Equivalent Mixed-mode Characteristic Impedances for Differential Signa" by Siming Pan and Jun Fan
 

Abstract

Differential signal via structures in multi-layer printed circuit boards (PCBs) and packages are studied using an equivalent coupled multi-conductor transmission-line model. Thus, easy-to-understand transmission-line concepts, such as mixed-mode characteristic impedances and propagation constants, can be used to characterize the performance of differential signal via structures in a signal path. the closed-form expressions of per-unit-length parameters in the equivalent coupled multi-conductor transmission-line model are derived based on a physics-Based via circuit model with parallel-plane impedances and via-plate capacitances. Mode conversions are discussed for different via structures. Effects of geometrical parameters on equivalent differential via impedances are studied in the paper as well. the proposed method provides a straightforward approach to design differential via structures for better signal integrity. © 2009 IEEE.

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Differential via structures; Equivalent mixed-mode characteristic impedances; Mode conversions; Multi-conductor transmission line; Multi-layer PCBs and packages; Signal integrity

International Standard Book Number (ISBN)

978-142444267-6

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.

Publication Date

01 Dec 2009

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