Abstract
Differential signal via structures in multi-layer printed circuit boards (PCBs) and packages are studied using an equivalent coupled multi-conductor transmission-line model. Thus, easy-to-understand transmission-line concepts, such as mixed-mode characteristic impedances and propagation constants, can be used to characterize the performance of differential signal via structures in a signal path. the closed-form expressions of per-unit-length parameters in the equivalent coupled multi-conductor transmission-line model are derived based on a physics-Based via circuit model with parallel-plane impedances and via-plate capacitances. Mode conversions are discussed for different via structures. Effects of geometrical parameters on equivalent differential via impedances are studied in the paper as well. the proposed method provides a straightforward approach to design differential via structures for better signal integrity. © 2009 IEEE.
Recommended Citation
S. Pan and J. Fan, "Equivalent Mixed-mode Characteristic Impedances for Differential Signal Vias," IEEE International Symposium on Electromagnetic Compatibility, pp. 74 - 79, article no. 5284632, Institute of Electrical and Electronics Engineers, Dec 2009.
The definitive version is available at https://doi.org/10.1109/ISEMC.2009.5284632
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Differential via structures; Equivalent mixed-mode characteristic impedances; Mode conversions; Multi-conductor transmission line; Multi-layer PCBs and packages; Signal integrity
International Standard Book Number (ISBN)
978-142444267-6
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2009
