Abstract
Vias are typical discontinuities for high-speed signal transmission in printed circuit boards (PCBs). This paper proposes an equivalent multiconductor transmission-line model for via structures in multilayer PCBs. the proposed model is based on the physic-Based circuit model, taking into account distributed effects. Various via structures with arbitrary via number, trace connections, and via stubs can be effectively handled in the equivalent transmission-line model, which is sufficiently accurate and fast to be integrated into circuit simulators for via and link-path analysis. with the proposed model, well-known transmission-line theories can be borrowed for via modeling and characterization for signal integrity in high-speed digital circuits. the proposed model is validated with both full-wave simulations and measurements for multilayer PCBs with different via structures. © 1964-2012 IEEE.
Recommended Citation
S. Pan and J. Fan, "Characterization of Via Structures in Multilayer Printed Circuit Boards with an Equivalent Transmission-Line Model," IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 5, pp. 1077 - 1086, article no. 6176213, Institute of Electrical and Electronics Engineers, Apr 2012.
The definitive version is available at https://doi.org/10.1109/TEMC.2012.2187664
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Equivalent multiconductor transmission-line model for vias; Multilayer PCBs; Signal integrity; Via modeling and characterization
International Standard Serial Number (ISSN)
0018-9375
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
05 Apr 2012
Comments
National Science Foundation, Grant 0855878