Via Coupling within Power-Return Plane Structures Considering the Radiation Loss

Author

Richard L. Chen
Ji Chen
Todd H. Hubing, Missouri University of Science and Technology
Weimin Shi

Abstract

An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered in this model. the radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. the quality factors associated with three loss mechanisms are calculated and compared. the effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss PCBs. Measurements are performed to validate the effectiveness this model.

Recommended Citation

R. L. Chen et al., "Via Coupling within Power-Return Plane Structures Considering the Radiation Loss," IEEE International Symposium on Electromagnetic Compatibility, vol. 2, pp. 386 - 391, Institute of Electrical and Electronics Engineers, Oct 2004.

Department(s)

Electrical and Computer Engineering

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.

Publication Date

08 Oct 2004