Abstract
A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. the method is a semi-numerical approach based on the combination of the moment method and the scattering matrix method. © 2007 IEEE.
Recommended Citation
E. P. Li et al., "A Systematic Semi-Numerical Approach for Modeling of Signal and Power Integrity of Electronic Packages," IEEE International Symposium on Electromagnetic Compatibility, article no. 4305768, Institute of Electrical and Electronics Engineers, Dec 2007.
The definitive version is available at https://doi.org/10.1109/ISEMC.2007.188
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Electronic package; Power integrity; Signal integrity; System-level modeling
International Standard Book Number (ISBN)
978-142441350-8
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2007
