Microwave Sensitivity Maximization of Disbond Characterization in Conductor Backed Dielectric Composites
Abstract
A swept frequency microwave nondestructive technique for detection of disbond in a dielectric composite backed by a conducting plate is discussed. The theoretical development is based on an incident plane wave illuminating such a medium, and then formulating the characteristics of the reflected wave. This way the effective reflection coefficient of the medium is found. The phase of this reflection coefficient changes in the presence of a disbonded medium. with the determination of an optimally sensitive frequency range using the theoretical model and the known properties of the composite dielectric material, it is shown that disbonds on the order of a few microns can be accurately detected at relatively low microwave frequencies. Several experimental results are also presented.
Recommended Citation
J. Edwards and R. Zoughi, "Microwave Sensitivity Maximization of Disbond Characterization in Conductor Backed Dielectric Composites," Journal of Nondestructive Evaluation, vol. 12, no. 3, pp. 193 - 198, Springer-Verlag, Sep 1993.
The definitive version is available at https://doi.org/10.1007/BF00567087
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Delamination; Dielectric Composite; Disbond; Microwaves; Swept Frequency; Composite Testing and Evaluation
International Standard Serial Number (ISSN)
0195-9298
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 1993 Springer-Verlag, All rights reserved.
Publication Date
01 Sep 1993
