Abstract
A method and apparatus for thermal modeling of on-chip interconnects using electromagnetic tools to determine a temperature profile across the interconnect structure and the temperature at each node of an equivalent thermal circuit derived from an electrical model.
Recommended Citation
L. Jiang et al., "Methodology for Thermal Modeling of On-chip Interconnects Based on Electromagnetic Simulation Tools," US Patent Office, The Authors, Jun 2009.
Department(s)
Electrical and Computer Engineering
Document Type
Patent
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 The Authors, All rights reserved.
Publication Date
2009-06-25
Comments
US 2009/0164183 A1