Abstract

A method and apparatus for thermal modeling of on-chip interconnects using electromagnetic tools to determine a temperature profile across the interconnect structure and the temperature at each node of an equivalent thermal circuit derived from an electrical model.

Department(s)

Electrical and Computer Engineering

Comments

US 2009/0164183 A1

Document Type

Patent

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 The Authors, All rights reserved.

Publication Date

2009-06-25

Share

 
COinS