Abstract
We present an overview of challenge problems in electromagnetic modeling of highly complex and multi-scale structures found in 3D IC, SiP, SoC, and electronic packaging necessary for signal integrity assessment. © 2013 IEEE.
Recommended Citation
W. C. Chew and A. C. Cangellaris and J. Schutt-Aine and H. Braunisch and Z. G. Qian and A. A. Aydiner and K. Aygun and L. J. Jiang and Z. H. Ma and L. L. Meng and M. Naeem, "Fast And Accurate Multiscale Electromagnetic Modeling Framework: An Overview," 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013, article no. 6558315, Institute of Electrical and Electronics Engineers, Aug 2013.
The definitive version is available at https://doi.org/10.1109/SaPIW.2013.6558315
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
3D IC; accurate; electromagnetics; fast; modeling; multiscale; signal integrity; SiP; SoP
International Standard Book Number (ISBN)
978-146735678-7
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
20 Aug 2013
