Abstract
Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various data pattern combinations, which benefits identifying worst case scenario. In addition, data reconstruction can be evaluated through the phase shift, which simplifies identifying the EMI of any pulse bit pattern. This work provides a basic modeling framework for comprehensive radiation studies.
Recommended Citation
N. K. Huang et al., "Data Pattern Based Electromagnetic Interference Modeling For IC Packaging," 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014, pp. 227 - 230, article no. 7103640, Institute of Electrical and Electronics Engineers, Jan 2014.
The definitive version is available at https://doi.org/10.1109/EPEPS.2014.7103640
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
cavity mode; EM radiated emission; EMI; IC packaging; linear superposition; via trace radiation
International Standard Book Number (ISBN)
978-147993641-0
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2014
