Abstract
Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the electromagnetic emission for the high speed multi-channels on IC packagings. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superpose the contribution of different signal patterns. As a result, with limited pre-calculations, it is very convenient to compute the electromagnetic emission efficiently from different signals with various data pattern combinations, which benefits identifying worst case scenario. This work provides a statistical analysis modeling framework for comprehensive radiation studies. It directly benefits fundamental understandings and guideline designs for IC packaging and PCB EMI reductions.
Recommended Citation
N. K. Huang et al., "A Novel Data Pattern Dependent Electromagnetic Emission Modeling For High Speed Multi-channel Interconnects," 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016, pp. 735 - 737, article no. 7522850, Institute of Electrical and Electronics Engineers, Jul 2016.
The definitive version is available at https://doi.org/10.1109/APEMC.2016.7522850
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
cavity mode; EM radiated emission; EMI; IC packaging; linear superposition; via trace radiation
International Standard Book Number (ISBN)
978-146739494-9
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
26 Jul 2016
