Abstract
In the high-speed signal path on PCB and packagings, vias usually causes most discontinuities and thereby crosstalks. In simulation and characterizations, they also generate more errors than the trace parts due to rich modes around them. To achieve both efficiency and accuracy, in this paper, a new domain decomposition based finite element time domain (FETD) method is proposed for the analysis of power/ground plate pairs with various types of antipads. Using the magnetic field feature, the 3D computational domain is firstly represented by a quasi-2D field. Then by taking advantage of the fast decaying property of high order modes, the quasi-2D FETD is further simplified to a hybrid 2D/quasi-2D algorithm. Assisted by the wave-port excitation and its S-parameter extraction technique, irregularly shaped antipads of complex via patterns are benchmarked to demonstrate the accuracy and efficiency of the proposed algorithm.
Recommended Citation
P. Li et al., "A New Efficient Domain Decomposition Method For Highly Irregular Via Patterns," EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems, pp. 189 - 191, article no. 8534309, The Institute of Engineering and Technology, Nov 2018.
The definitive version is available at https://doi.org/10.1109/EPEPS.2018.8534309
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Antipads; Domain Decomposition; FETD; Quasi-2D; Via Patterns
International Standard Book Number (ISBN)
978-153869303-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 The Institute of Engineering and Technology, All rights reserved.
Publication Date
13 Nov 2018
Comments
National Natural Science Foundation of China, Grant FA2386-17-1-0010