Abstract
Fast integral equation methods are now being applied to packaging and other such "low frequency" problems. This paper explores some of the issues surrounding such an application to real, product level packaging and interconnect type structures. Discussed are issues such as low frequency breakdown, mesh aspect ratios, and solver convergence. Finally, integral equation solver examples are presented using the IBM internally developed pre-corrected FFT (PFFT) solver labeled EMSurf[l]. ©2006 IEEE.
Recommended Citation
J. D. Morsey et al., "The Use Of Fast Integral Equations Solvers For Practical Package And Interconnect Analysis," Electrical Performance of Electronic Packaging, EPEP, pp. 335 - 338, article no. 4115424, Institute of Electrical and Electronics Engineers, Dec 2006.
The definitive version is available at https://doi.org/10.1109/EPEP.2006.321246
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Electromagnetic modeling tools; Fast solvers; Full-wave electromagnetic field solver; Iterative solutions
International Standard Book Number (ISBN)
978-142440668-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2006
