Abstract
The paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only Equivalent Principle based EFIE instead of both EFIE and MFIE to establish the surface integral equations for practical inhomogeneous structure so that a much more simplified formulation process is needed in the EM simulation procedure. To overcome the numerical error of K operator in the formulation, a new analytical solution to the K operator for general full-wave integral equations is provided. Numerical results are demonstrated to verify the proposed algorithm. © 2007 IEEE.
Recommended Citation
L. Jiang et al., "Electromagnetic Simulation For Inhomogeneous Interconnect And Packaging Structures," IEEE Topical Meeting on Electrical Performance of Electronic Packaging, pp. 357 - 360, article no. 4387202, Institute of Electrical and Electronics Engineers, Dec 2007.
The definitive version is available at https://doi.org/10.1109/EPEP.2007.4387202
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-142440883-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2007
