Abstract
The thin, high-contrast, fine layers with dielectric and conductive properties, such as ground planes, are feature structures in IC packagings. Their responses to the pulsed electromagnetic field is important both theoretically and practically. In this paper, a new semi-analytical method is proposed to model the interaction of the layer with an incident electromagnetic field via a boundary condition that expresses the in-plane conduction and contrast electric polarization currents in terms of the exciting incident field by relating the jump in the tangential component of the magnetic field strength across the layer in terms of the (continuous) tangential component of the electric field strength in the layer. Expressions for pulse shapes of the reflected and transmitted fields are conveniently obtained based on this method. It provides a novel angle to investigate the ground plane effects inside IC packagings. ©2010 IEEE.
Recommended Citation
A. T. De Hoop and L. Jiang, "Time-domain Field Responses Of The Thin, High-contrast, Finely Layered Structure In IC Packagings," 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp. 233 - 236, article no. 5642586, Institute of Electrical and Electronics Engineers, Jan 2010.
The definitive version is available at https://doi.org/10.1109/EPEPS.2010.5642586
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-142446865-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2010
