Abstract
It is evident that the low frequency full wave electromagnetic modelling is necessary for IC packaging analysis. Considering the complexity, it is very difficult to solve the whole problem directly. Even though the domain decomposition method is a legitimate approach for these types of problems, the domain decomposition method based on the equivalence principle has the low frequency breakdown issue. In this paper, we developed a low frequency augmented equivalence principle algorithm (AEPA) with the augmented electric field integral equation (AEFIE) for packaging and IC analysis. On the equivalence surfaces, not only the electric current and the magnetic current, but also the electric charge and the magnetic charge are used to capture the low frequency couplings. Inside each AEPA box, AEFIE is applied to maintain the low frequency accuracy. As a result, we are able to solve low frequency domain decomposition problems and apply it to IC packaging analysis.
Recommended Citation
Z. Ma et al., "Augmented EPA With Augmented EFIE Method For Packaging Analysis," 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010, article no. 5683002, Institute of Electrical and Electronics Engineers, Dec 2010.
The definitive version is available at https://doi.org/10.1109/EDAPS.2010.5683002
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-142449068-4
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2010
