Abstract
A hybrid electromagnetics (EM)-circuit simulator exploiting the discontinuous Galerkin time domain (DGTD) method and the modified nodal analysis (MNA) algorithm is developed for analyzing hybrid distributive and nonlinear multiport lumped circuit systems. The computational domain is split into two subsystems. One is the EM subsystem that is analyzed by DGTD, while the other is the circuit subsystem that is solved by the MNA method. The coupling between the EM and circuit subsystems is enforced at the lumped port where related field and circuit unknowns are coupled via the use of numerical flux, port voltages, and current sources. Since the spatial operations of DGTD are localized, thanks to the use of numerical flux, coupling matrices between EM and circuit subsystems are small and are directly inverted. To handle nonlinear devices within the circuit subsystem, the standard Newton-Raphson method is applied to the nonlinear coupling matrix system. In addition, a local time-stepping scheme is applied to improve the efficiency of the hybrid solver. Numerical examples including single and multiport linear/nonlinear circuit networks are presented to validate the proposed solver. © 2014 IEEE.
Recommended Citation
P. Li et al., "Cosimulation Of Electromagnetics-circuit Systems Exploiting DGTD And MNA," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, pp. 1052 - 1061, article no. 6814277, Institute of Electrical and Electronics Engineers; Electronics Packaging Society, Jan 2014.
The definitive version is available at https://doi.org/10.1109/TCPMT.2014.2316137
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Discontinuous Galerkin time domain (DGTD) method; hybrid EM-circuit solver; local time stepping (LTS); modified nodal analysis (MNA); multiport circuit networks; Newton-Raphson method; nonlinear elements; transient analysis.
International Standard Serial Number (ISSN)
2156-3950
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers; Electronics Packaging Society, All rights reserved.
Publication Date
01 Jan 2014