Abstract

Thin films of CdS were grown onto (111) silicon substrates (wafers 2 in in diameter) by employing a horizontal, low-pressure MOCVD system. The observed growth of heteroepitaxial films occurred in the temperature range of 275-325 ±5 °C. The growth of polycrystalline samples with a high degree of preferred orientation occurred at temperatures above 325 ± 5 °C. The later films exhibited irregularly shaped surface pits about 1 μm in depth. These pits were observed by sectioning the substrates and examining them with an SEM; no significant crystallinity was apparent. X-ray analysis of an heteroepitaxial and a polycrystalline film via a profile fitting algorithm revealed bulk strain values normal to the silicon substrate of 0.283% and 0.128% respectively. © 1989.

Department(s)

Electrical and Computer Engineering

International Standard Serial Number (ISSN)

0040-6090

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2023 Elsevier, All rights reserved.

Publication Date

01 Sep 1989

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