Prepreg and Core Dielectric Permittivity (εᵣ) Extraction for Fabricated Stripline' Far-End Crosstalk Modeling
Abstract
As the data rate and density of digital high-speed systems are getting higher, far-end crosstalk (FEXT) noise becomes one of the major issues that limit signal integrity performance. It was commonly believed that FEXT would be eliminated for striplines routed in a homogeneous dielectric, but in reality, FEXT can always be measured in striplines on the fabricated printed circuit boards. A slightly different dielectric permittivity (εr) of prepreg and core may be one of the major contributors to the FEXT. This article is focusing on providing a practical FEXT modeling methodology for striplines by introducing an approach to extract εr of prepreg and core. Using the known cross-sectional geometry and measured S-parameters of the coupled stripline, the capacitance components in prepreg and core are separated using a two-dimensional solver, and the εr of prepreg and core is determined. A more comprehensive FEXT modeling approach is proposed by applying extracted inhomogeneous dielectric material information.
Recommended Citation
S. Yong and S. Penugonda and D. Kim and V. Khilkevich and B. Pu and X. Ye and Q. Gao and X. D. Cai and B. Sen and J. Fan, "Prepreg and Core Dielectric Permittivity (εᵣ) Extraction for Fabricated Stripline' Far-End Crosstalk Modeling," IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers (IEEE), Jun 2021.
The definitive version is available at https://doi.org/10.1109/TEMC.2021.3083771
Department(s)
Electrical and Computer Engineering
Publication Status
Early Access
Keywords and Phrases
Capacitance; Conductors; Dielectric Material; Dielectric Materials; Dielectrics; Far-End Crosstalk (FEXT); Nonhomogeneous Media; Permittivity Measurement; Stripline; Stripline; Transmission-Line Theory
International Standard Serial Number (ISSN)
0018-9375; 1558-187X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2021 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
10 Jun 2021