Title

Measurement Investigation of MLCC Mounting Variation Impact on Acoustic Noise in Power Distribution Network

Abstract

The multilayer ceramic capacitors (MLCCs) mounting method impact on the MLCC induced acoustic noise in printed circuit board (PCB) is investigated through measurement. The influence of MLCC soldering stencil height, MLCC orientation and MLCC pair offset distance are evaluated on a series of test boards. The sound pressure level (SPL) is measured to evaluate the PCB acoustic noise performance. In the investigated mounting variation range, the acoustic noise performance does not exhibit noticeable changes.

Meeting Name

2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, EMCSI 2020 (2020: Jul. 27-31, Virtual)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Acoustic Noise; Mirrored Layout; Mounting; Multilayer Ceramic Capacitors; Power Distribution Network; Sound Pressure Level

International Standard Book Number (ISBN)

978-172817430-3

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2020 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

10 Sep 2020

Share

 
COinS