Measurement Investigation of MLCC Mounting Variation Impact on Acoustic Noise in Power Distribution Network
Abstract
The multilayer ceramic capacitors (MLCCs) mounting method impact on the MLCC induced acoustic noise in printed circuit board (PCB) is investigated through measurement. The influence of MLCC soldering stencil height, MLCC orientation and MLCC pair offset distance are evaluated on a series of test boards. The sound pressure level (SPL) is measured to evaluate the PCB acoustic noise performance. In the investigated mounting variation range, the acoustic noise performance does not exhibit noticeable changes.
Recommended Citation
Y. Sun et al., "Measurement Investigation of MLCC Mounting Variation Impact on Acoustic Noise in Power Distribution Network," Proceedings of the 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, pp. 363 - 368, Institute of Electrical and Electronics Engineers (IEEE), Sep 2020.
The definitive version is available at https://doi.org/10.1109/EMCSI38923.2020.9191464
Meeting Name
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, EMCSI 2020 (2020: Jul. 27-31, Virtual)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Acoustic Noise; Mirrored Layout; Mounting; Multilayer Ceramic Capacitors; Power Distribution Network; Sound Pressure Level
International Standard Book Number (ISBN)
978-172817430-3
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2020 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
10 Sep 2020
