Coupling Path Visualization and EMI Mitigation for Flyover QSFP Connectors

Author

Atieh Talebzadeh
Pranay K. Vuppunutala
Kyoungchoul Koo
Hongyu Li, Broadcom Inc., San Jose
Jim Nadolny
Qian Liu
Jing Li
Kaustav Ghosh
Philippe C. Sochoux
Victor Khilkevich, Missouri University of Science and TechnologyFollow
James L. Drewniak, Missouri University of Science and TechnologyFollow
David Pommerenke, Missouri University of Science and TechnologyFollow

Abstract

In this article, the energy parcels concept is used to reveal radiation physics and coupling in the entire structure of flyover quad form-factor pluggable (QSFP) interconnection. Flyover QSFP has better signal integrity than legacy surface mounted printed circuit board QSFP technology. To understand electromagnetic interference aspects, a simulation model was built and correlated to measured total radiated power (TRP) for common mode and differential mode excitations for a frequency range of 1-40 GHz. Further, the energy parcels and their trajectories concept were applied to visualize the coupling path by tracking back the energy parcels from outside of the chassis (quiet side) toward a host board inside the chassis (noisy side). Then, high-density regions of energy parcel trajectories guide where to place the absorbing material efficiently and appropriately. Two locations were examined by filling them with electromagnetic lossy material and improvement was validated by TRP simulation and measurement.

Recommended Citation

A. Talebzadeh and P. K. Vuppunutala and K. Koo and H. Li and J. Nadolny and Q. Liu and J. Li and K. Ghosh and P. C. Sochoux and V. Khilkevich and J. L. Drewniak and D. Pommerenke, "Coupling Path Visualization and EMI Mitigation for Flyover QSFP Connectors," IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 4, pp. 1037 - 1044, Institute of Electrical and Electronics Engineers (IEEE), Oct 2019.

The definitive version is available at https://doi.org/10.1109/TEMC.2019.2943290

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Coupling Path; Electromagnetic Interference (EMI) Mitigation; EMI/EMC; Energy Parcel; Quad Form-Factor Pluggable (QSFP) Interconnect; Reverberation Chamber; Total Radiated Power (TRP)

International Standard Serial Number (ISSN)

0018-9375; 1558-187X

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

22 Oct 2019