"Wireless Power Distribution Network for 3D Package using Magnetic Fiel" by Eunseok Song, Hongseok Kim et al.
 

Wireless Power Distribution Network for 3D Package using Magnetic Field Resonance

Abstract

In this paper, a wireless power transfer (WPT) scheme using magnetic field resonances for 3D packages is proposed and a wireless power distribution network (PDN) in a WPT system is analyzed in terms of the simultaneous switching noise (SSN). For analyzing the wireless PDN impedance characteristic and the power efficiency, a ball grid array (BGA) package with a size of 35 mmx35 mm is fabricated. Also, a new schematic of the wire PDN is defined to analyze a WPT system applied to the WPT system in terms of SSN. The impedance (Z11) characteristics between the interconnection-based hierarchical PDN structure and the hierarchical PDN based on the proposed WPT scheme are compared and analyzed. The package-level WPT system proposed in this study represents excellent wireless PDN impedance characteristics in decreasing the power noise occurred in a 3D package.

Meeting Name

6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 (2013: Dec. 12-15, Nara, Japan)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

3D Package; Inductor Design; Magnetic Field; PDN-Impedance; Power Distribution Network (PDN); Power Efficiency; Resonance; Simultaneous Switching Noise (SSN); Wireless Power Transfer (WPT)

International Standard Book Number (ISBN)

978-147992311-3

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

15 Dec 2013

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