Wireless Power Distribution Network for 3D Package using Magnetic Field Resonance
Abstract
In this paper, a wireless power transfer (WPT) scheme using magnetic field resonances for 3D packages is proposed and a wireless power distribution network (PDN) in a WPT system is analyzed in terms of the simultaneous switching noise (SSN). For analyzing the wireless PDN impedance characteristic and the power efficiency, a ball grid array (BGA) package with a size of 35 mmx35 mm is fabricated. Also, a new schematic of the wire PDN is defined to analyze a WPT system applied to the WPT system in terms of SSN. The impedance (Z11) characteristics between the interconnection-based hierarchical PDN structure and the hierarchical PDN based on the proposed WPT scheme are compared and analyzed. The package-level WPT system proposed in this study represents excellent wireless PDN impedance characteristics in decreasing the power noise occurred in a 3D package.
Recommended Citation
E. Song et al., "Wireless Power Distribution Network for 3D Package using Magnetic Field Resonance," Proceedings of the 6th IEEE Electrical Design of Advanced Packaging Systems Symposium (2013, Nara, Japan), pp. 32 - 35, Institute of Electrical and Electronics Engineers (IEEE), Dec 2013.
The definitive version is available at https://doi.org/10.1109/EDAPS.2013.6724450
Meeting Name
6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 (2013: Dec. 12-15, Nara, Japan)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
3D Package; Inductor Design; Magnetic Field; PDN-Impedance; Power Distribution Network (PDN); Power Efficiency; Resonance; Simultaneous Switching Noise (SSN); Wireless Power Transfer (WPT)
International Standard Book Number (ISBN)
978-147992311-3
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
15 Dec 2013
