Measurement and Analysis of Voltage Transfer Ratio (VTR) of Package-Level WPT Considering PDN Conditions
In this study, a three dimensional multi-helix inductor design with a size smaller than 10mmx10mm is proposed for package-level wireless power transfer (WPT) using magnetic resonance, and the performance of an inductor-to-inductor voltage transfer ratio (VTR) of 70.1 % is presented. The effect of the power distribution network (PDN) load impedance on the VTR is studied and verified through measurement of the fabricated package-level WPT system. The PDN conditions consist of a power/ground (P/G) plane and various decoupling capacitors with different capacitances (10 nF, 100 nF, and 1 µF). The PDN impedance of the receiver package exhibits resonant frequencies that depend on the stack-up and dimension of the power/ground planes and also the capacitances and the locations of the decoupling capacitors. As the resonance frequency of the WPT system approaches the resonance frequency of the PDN connected to the end of the WPT system as a load, the VTR efficiency rapidly decreases. In addition, the VTR performance of the package-level WPT system can be further improved to a maximum of 18.84 % with the insertion of ferrite sheets.
E. Song et al., "Measurement and Analysis of Voltage Transfer Ratio (VTR) of Package-Level WPT Considering PDN Conditions," Proceedings of the 2013 Asia-Pacific Symposium on Electromagnetic Compatibility (2013, Melbourne, Australia), Institute of Electrical and Electronics Engineers (IEEE), May 2013.
The definitive version is available at https://doi.org/10.1109/APEMC.2013.7360616
Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2013 (2013: May 20-23, Melbourne, Australia)
Electrical and Computer Engineering
Keywords and Phrases
Inductive Coupling; Package-Level WPT; Power Distribution Network (PDN); Voltage Transfer Ratio (VTR); Wireless Power Transfer (WPT)
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
23 May 2013