Suppression of Leakage Magnetic Field from a Wireless Power Transfer System using Ferrimagnetic Material and Metallic Shielding
Abstract
This paper describes a method to suppress the leakage magnetic field from a wireless power transfer (WPT) system through the use of a ferrimagnetic material and metallic shielding. To demonstrate the advantages of the coil structure with the ferrimagnetic material and metallic shielding, magnetic field distributions and the electrical performance of three different coil structures are investigated via 3D electromagnetic (EM) field solver and SPICE simulation. Results show that the suggested method considerably reduces the leakage magnetic field in the vicinity of the WPT system without significant loss of electrical performance. The simulation results of the suggested coil structure are experimentally verified with a 100 W-class WPT system for an LED TV.
Recommended Citation
H. Kim et al., "Suppression of Leakage Magnetic Field from a Wireless Power Transfer System using Ferrimagnetic Material and Metallic Shielding," Proceedings of the 2012 IEEE International Symposium on Electromagnetic Compatibility (2012, Pittsburgh, PA), pp. 640 - 645, Institute of Electrical and Electronics Engineers (IEEE), Aug 2012.
The definitive version is available at https://doi.org/10.1109/ISEMC.2012.6351659
Meeting Name
2012 IEEE International Symposium on Electromagnetic Compatibility, EMC 2012 (2012: Aug. 5-10, Pittsburgh, PA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Coil Structures; Electrical Performance; Leakage Magnetic Field; Magnetic Field Distribution; SPICE Simulations; Wireless Power Transfer, Computer Simulation; Electromagnetic Compatibility; Shielding; SPICE, Magnetic Fields
International Standard Book Number (ISBN)
978-146732061-0
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2012 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
10 Aug 2012