Accurate RFI Prediction of 3D Non-Planar Connector with Half Magnetic Dipole Pattern
In this paper, a dipole-moment based reciprocity method is applied to a consumer electronic device. The dipole moment is then used to predict radio-frequency interference (RFI) from a high-speed connector to two nearby RF antennas. The connector has a 3D structure with data pins verticallyoriented, for which the near H field pattern around the connector shows a half magnetic dipole pattern. This is different from typical complete dipole patterns over planar printed PCB (printed circuit board) structures. To tackle this problem, a magnetic dipole is placed in full-wave simulation with a similar connector structure. Using the reference near field data from simulation an equivalent magnetic dipole moment for the measured field is obtained. Further reciprocity theorem is applied to predict RFI based on the equivalent dipole magnitude and the antenna reverse H field. The predicted RFI shows a fairly good match with the measured RFI for both victim antennas.
L. Zhang et al., "Accurate RFI Prediction of 3D Non-Planar Connector with Half Magnetic Dipole Pattern," Proceedings of the 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (2019, Sapporo, Japan), pp. 770-773, Institute of Electrical and Electronics Engineers (IEEE), Jun 2019.
The definitive version is available at https://doi.org/10.23919/EMCSapporo/APEMC44270.2019.8976328
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019 (2019: Jun. 3-7, Sapporo, Japan)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Dipole Moment; Half Dipole Pattern; High-Speed Connector; Near-Field Scanning; Radio-Frequency Interference; Reciprocity
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2019 Institute of Electronics, Information and Communication Engineer, All rights reserved.
01 Jun 2019