Title

Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism

Abstract

This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron's mesh impedance tensor obtained via the PCB Kron's equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.

Meeting Name

12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019 (2019: Oct. 21-23, Haining, Hangzhou, China)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Modelling; Printed Circuit Board (PCB); S Parameter Analysis; Sensitivity Analysis (SA); Tensorial Analysis of Network (TAN)

International Standard Book Number (ISBN)

978-172814261-6

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2019

Share

 
COinS