Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism
This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron's mesh impedance tensor obtained via the PCB Kron's equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.
Z. Xu et al., "Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism," Proceedings of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (2019, Haining, Hangzhou, China), pp. 81-83, Institute of Electrical and Electronics Engineers (IEEE), Oct 2019.
The definitive version is available at https://doi.org/10.1109/EMCCompo.2019.8919915
12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019 (2019: Oct. 21-23, Haining, Hangzhou, China)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Modelling; Printed Circuit Board (PCB); S Parameter Analysis; Sensitivity Analysis (SA); Tensorial Analysis of Network (TAN)
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Oct 2019