Generic Modeling of Via-Stripline Structures in Multi-Layer Board for High Speed Applications
Abstract
To accelerate the simulation timing for more general structures like a stripline connected between vias, generic models were developed for a differential strip line connecting differential pair of vias. While a less time consuming 2-dimensional (2D) simulations are used for striplines, an analytical approximation has been employed for vias. The models developed have shown close correlation (within+/-1.5 dB) with that of 3D full wave simulation models with frequency ranges of 10 MHz to 20 GHz.
Recommended Citation
S. Penugonda et al., "Generic Modeling of Via-Stripline Structures in Multi-Layer Board for High Speed Applications," Proceedings of the 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2019, New Orleans, LA), pp. 321 - 326, Institute of Electrical and Electronics Engineers (IEEE), Jul 2019.
The definitive version is available at https://doi.org/10.1109/ISEMC.2019.8825228
Meeting Name
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (2019: Jul. 22-26, New Orleans, LA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
ADS; Circuit Modeling of Via-Stripline Interconnects; HFSS; Parallel Plate Impedance; Stripline Modeling; Via Capacitance; Via Stripline Interconnects
International Standard Book Number (ISBN)
978-153869199-1
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2019
