Time-Reversal SAR Imaging for Nondestructive Testing of Circular and Cylindrical Multi-Layered Dielectric Structures
Abstract
In this paper, a synthetic aperture radar (SAR) approach, for imaging internal structures of generally lossy layered dielectric cylindrical objects, is presented. This method which properly accounts for different transmission and refraction path at each boundary between different layers, produces a properly focused image of embedded targets. This approach is also capable of addressing imaging needs for asymmetrical multi-layered cylindrical bodies. Consequently, this approach overcomes the limitation associated with the conventional methodology, in which free-space propagation is assumed. The calculation method of angular sampling criterion for circular and cylindrical SAR (i.e., circumferential and in height) are also presented. Electromagnetic simulations are performed on a three-layer cylindrical object, symmetrical and asymmetrical, with embedded targets to validate the approach. In addition, representative measurements are conducted at X-band (8.2-12.4 GHz) demonstrating the effectiveness of the approach for practical nondestructive evaluation applications.
Recommended Citation
B. Wu et al., "Time-Reversal SAR Imaging for Nondestructive Testing of Circular and Cylindrical Multi-Layered Dielectric Structures," IEEE Transactions on Instrumentation and Measurement, vol. 69, no. 5, pp. 2057 - 2066, Institute of Electrical and Electronics Engineers (IEEE), May 2020.
The definitive version is available at https://doi.org/10.1109/TIM.2019.2918371
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
INSPIRE - University Transportation Center
Keywords and Phrases
Synthetic aperture radar (SAR); microwave imaging; circular SAR; cylindrical SAR; time reversal
International Standard Serial Number (ISSN)
0018-9456; 1557-9662
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2020