Title

Power Integrity Concepts for High-Speed Design on Multi-Layer PCBs

Meeting Name

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 (2018: Jul. 30-Aug. 3, Long Beach, CA)

Department(s)

Electrical and Computer Engineering

International Standard Book Number (ISBN)

978-1-5386-6621-0

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2018

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