Power Integrity Concepts for High-Speed Design on Multi-Layer PCBs

Author

Chulsoon Hwang, Missouri University of Science and TechnologyFollow

Recommended Citation

C. Hwang, "Power Integrity Concepts for High-Speed Design on Multi-Layer PCBs," Proceedings of the 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (2018, Long Beach, CA), Institute of Electrical and Electronics Engineers (IEEE), Jul 2018.

The definitive version is available at https://doi.org/10.1109/EMCSI.2018.8495312

Meeting Name

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 (2018: Jul. 30-Aug. 3, Long Beach, CA)

Department(s)

Electrical and Computer Engineering

International Standard Book Number (ISBN)

978-1-5386-6621-0

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2018