Plane-Pair PEEC Modeling for Package Power Layer Nets with Inductance Extraction
Abstract
Recent FPGAS and CPUs consume significant power, and a low impedance power distribution network (PDN) is critical to get a robust performance. The decoupling capacitors in package usually provide charge for mid frequency switching currents, from tens of MHz to a few hundreds of MHz. The effectiveness of these capacitors are limited by the inductance associated with the current loop. Although commercial tools can estimate the PDN impedance, they do not generate a physics-based circuit which provides insight of where the inductance collects. In this short paper, a plane pair partial element equivalent circuit (PPP) method is applied to extract the inductance of the power layers on package. The method is validated by comparing with the cavity model and a commercial tool. The extracted inductance can be used to generate a physics based circuit model.
Recommended Citation
S. Bai et al., "Plane-Pair PEEC Modeling for Package Power Layer Nets with Inductance Extraction," Proceedings of the 2018 IEEE International Conference on Computational Electromagnetics (2018, Chengdu, China), Institute of Electrical and Electronics Engineers (IEEE), Mar 2018.
The definitive version is available at https://doi.org/10.1109/COMPEM.2018.8496468
Meeting Name
2018 IEEE International Conference on Computational Electromagnetics, ICCEM 2018 (2018: Mar. 26-28, Chengdu, China)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Electric network analysis; Equivalent circuits; Inductance; Program processors; Decoupling capacitor; Inductance extraction; Package modeling; Partial element equivalent circuit; Physics-based circuit models; Plane pair PEEC; Power distribution modeling; Power distribution network; Computational electromagnetics; Plane pair PEEC
International Standard Book Number (ISBN)
978-1-5386-1241-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Mar 2018
Comments
This paper is based upon work supported partially by the National Science Foundation under Grant No. IIP-1440110.