Mis-Registration of Sliver Type Backdrill Impact in High Speed Signal Propagation
Abstract
Nowadays, plated-through hole (PTH) via structures are extensively used in printed circuit boards (PCBs). As the data rate increases to Gigahertz range, the via stub resonance effect shows up, which will cause signal distortion and lead to signal integrity issue. In this paper, the impact caused by backdrill mis-registration issue is investigated.
Recommended Citation
H. Gao et al., "Mis-Registration of Sliver Type Backdrill Impact in High Speed Signal Propagation," Proceedings of the 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (2018, Long Beach, CA), pp. 62 - 65, Institute of Electrical and Electronics Engineers (IEEE), Jul 2018.
The definitive version is available at https://doi.org/10.1109/EMCSI.2018.8495160
Meeting Name
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 (2018: Jul. 30-Aug. 3, Long Beach, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Busbars; Electromagnetic compatibility; Polychlorinated biphenyls; Scattering parameters; Backdrill; High-speed signals; Plated through hole; Printed circuit board (PCBs); Resonance effect; Signal Integrity; Sliver; Via stub; Printed circuit boards; Mis-registration; PCB; Plated-through hole; S-parameter; Sliver; TDR; Via stub
International Standard Book Number (ISBN)
978-1-5386-6621-0
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2018
