Message from Technical Program Committee Chairs

Author

Jun Fan, Missouri University of Science and TechnologyFollow
Richard Xian-Ke Gao

Recommended Citation

J. Fan and R. X. Gao, "Message from Technical Program Committee Chairs," Proceedings of the 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (2018, Singapore, Singapore), pp. 2 - 2, Institute of Electrical and Electronics Engineers (IEEE), May 2018.

The definitive version is available at https://doi.org/10.1109/ISEMC.2018.8393719

Meeting Name

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 (2018: May 14-17, Singapore, Singapore)

Department(s)

Electrical and Computer Engineering

International Standard Book Number (ISBN)

978-1-5090-5997-3

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 May 2018