Facilitating Failure Analysis with Software Instrumentation
Abstract
The ultimate goal of the research presented in this paper is analysis, modeling, and prediction of failure in an embedded system. To this end, we propose software instrumentation that can facilitate monitoring and evaluation of the status of an embedded system. We illustrate the approach with a simple case study and describe how population of a failure model can be carried out using the data collected. The information gained facilitates assurance of embedded systems, as it provides a means for collecting the data required for determining dependability attributes such as reliability and survivability.
Recommended Citation
B. J. Ziegler et al., "Facilitating Failure Analysis with Software Instrumentation," Proceedings of 2019 IEEE 19th International Symposium on High Assurance Systems Engineering (2019, Hangzhou, China), pp. 139 - 145, IEEE Computer Society, Jan 2019.
The definitive version is available at https://doi.org/10.1109/HASE.2019.00029
Meeting Name
2019 IEEE 19th International Symposium on High Assurance Systems Engineering, HASE 2019 (2019: Jan. 3-5, Hangzhou, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Intelligent Systems Center
Keywords and Phrases
Failure (mechanical); Fault detection; Fault tolerant computer systems; Population statistics; Safety engineering; Systems engineering; Failure model; Fault tolerant systems; Monitoring and evaluations; Prediction of failures; Software instrumentation; Software methods; Embedded systems; Failure modeling; Fault-tolerant systems
International Standard Book Number (ISBN)
978-1-5386-8540-2
International Standard Serial Number (ISSN)
2640-7507; 1530-2059
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 IEEE Computer Society, All rights reserved.
Publication Date
01 Jan 2019
Comments
This work was supported by the Intelligent Systems Center at the Missouri University of Science and Technology and the NSF I/UCRC for Electromagnetic Compatibility (CEMC).