A Simulation-Based Coupling Path Characterization to Facilitate Desense Design and Debugging
Abstract
Coupling path characterization is the most critical part of the simulation-based method to investigate desense issues. This paper introduces the workflow to model and validate the coupling path. The workflow is then embodied in a practical case where the GPS system of a phone is severely desensitized by the camera flex. The coupling path between the camera flex and the GPS antenna is successfully characterized and validated by measurement. The obtained coupling path model is further utilized to study factors that potentially affect the noise coupling from the camera flex to the GPS system. Knowledge of these factors facilitates desense design and debugging. Design guidelines are proposed based on the coupling path model.
Recommended Citation
Y. Wang et al., "A Simulation-Based Coupling Path Characterization to Facilitate Desense Design and Debugging," Proceedings of the 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (2018, Long Beach, CA), pp. 150 - 155, Institute of Electrical and Electronics Engineers (IEEE), Jul 2018.
The definitive version is available at https://doi.org/10.1109/EMCSI.2018.8495193
Meeting Name
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 (2018: Jul. 30-Aug. 3, Long Beach, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Busbars; Cameras; Satellite antennas; Coupling paths; GPS antenna; Gps systems; Noise coupling; Simulation-based method; Electromagnetic compatibility
International Standard Book Number (ISBN)
978-1-5386-6621-0
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2018
Comments
This work was supported by Google Inc. and the National Science Foundation (NSF) under Grants No. IIP-1440110.