Measurement and Comparative Analysis of Shielding Effectiveness of Different Sputtered Materials
Recently, high density integrated circuits are packaged in the electronic devices such as smartphones and smartwatches. Power amplifier modules integrated in such devices interact with other circuits due to its inductive components, and may cause the electromagnetic interference issues. To reduce the electromagnetic issues, sputtering technology can be used. In this paper, we present the shielding effectiveness measurement results of sputtered shielding materials in the low-frequency range from 30 kHz to 20 MHz using a vector network analyzer. Sputtered shielding materials are copper, nickel, titanium and stainless steel. By comparing the insertion loss, the shielding effectiveness is analyzed. The effect of the sputtered materials' thickness is also analyzed. Among the four materials, sputtered copper has the highest shielding effectiveness.
K. Song et al., "Measurement and Comparative Analysis of Shielding Effectiveness of Different Sputtered Materials," Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017, Washington, DC), pp. 355-359, Institute of Electrical and Electronics Engineers (IEEE), Aug 2017.
The definitive version is available at https://doi.org/10.1109/ISEMC.2017.8077894
2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 (2017: Aug. 7-11, Washington, DC)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
electromagnetic interference; ferromagnetic material; metal; shielding effectiveness; Sputtering
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2017