Measurement and Comparative Analysis of Shielding Effectiveness of Different Sputtered Materials

Abstract

Recently, high density integrated circuits are packaged in the electronic devices such as smartphones and smartwatches. Power amplifier modules integrated in such devices interact with other circuits due to its inductive components, and may cause the electromagnetic interference issues. To reduce the electromagnetic issues, sputtering technology can be used. In this paper, we present the shielding effectiveness measurement results of sputtered shielding materials in the low-frequency range from 30 kHz to 20 MHz using a vector network analyzer. Sputtered shielding materials are copper, nickel, titanium and stainless steel. By comparing the insertion loss, the shielding effectiveness is analyzed. The effect of the sputtered materials' thickness is also analyzed. Among the four materials, sputtered copper has the highest shielding effectiveness.

Meeting Name

2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 (2017: Aug. 7-11, Washington, DC)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

electromagnetic interference; ferromagnetic material; metal; shielding effectiveness; Sputtering

International Standard Book Number (ISBN)

978-153862230-8

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2017

Link to Full Text

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