Effect of Inhomogeneous Medium on Fields Above GCPW PCB for Near-Field Scanning Probe Calibration Application
In this paper, a method is proposed to calibrate a probe by placing it into a known field and referencing its output voltage to the known field. A transmission line is a convenient structure for creating such a known field. This paper presents the effect of the inhomogeneous medium on the near-field generated over a grounded coplanar waveguide (GCPW) printed circuit board (PCB) and reports the field pattern over the GCPW. GCPW PCBs are used to determine the probe factor for near-field scanning applications. A near-field scan is performed to visualize the near-field sources over a device under test (DUT). The near-field is measured by using E- and H-field electromagnetic interference probes. The output of these probes is a voltage and using the probe factor, the field present over the DUT can be determined. To calculate the probe factor, the near-field strength needs to be known using the 3-D simulation. GCPW creates a quasi-TEM field. The effect of non-TEM modes is easily underestimated, such that non-TEM fields prevent the user from determining the unwanted field suppression of probes at higher frequencies.
S. Marathe et al., "Effect of Inhomogeneous Medium on Fields Above GCPW PCB for Near-Field Scanning Probe Calibration Application," IEEE Transactions on Electromagnetic Compatibility, vol. 61, no. 1, pp. 3-10, Institute of Electrical and Electronics Engineers (IEEE), Feb 2019.
The definitive version is available at https://doi.org/10.1109/TEMC.2018.2817119
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Atmospheric modeling; Calibration; Dielectrics; E-field probe; grounded coplanar waveguide (GCPW); H-field probe; near-field scanning; Nonhomogeneous media; probe calibration; Probes; Solid modeling; Transmission line measurements
International Standard Serial Number (ISSN)
Article - Journal
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
18 Feb 2019