Parallel Plate Impedance and Equivalent Inductance Extraction Considering Proximity Effect by a Modal Approach
Abstract
A modal approach for parallel plate impedance and equivalent inductance extraction for power integrity analysis including ball grid arrays (BGAs) between two parallel plates is presented. Since the BGAs are placed close to each other, the current flowing through each ball is not uniformly distributed due to the proximity effect. In this paper, a modal-based cavity method is proposed to count for this proximity effect. Analytical solutions for both the parallel plate impedance and the equivalent inductances associated with the BGAs are derived from the modal-based cavity method. The proposed method is validated by finite element method simulations and the application of the proposed method for power distribution network design is demonstrated.
Recommended Citation
S. Jin et al., "Parallel Plate Impedance and Equivalent Inductance Extraction Considering Proximity Effect by a Modal Approach," IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 5, pp. 1481 - 1490, Institute of Electrical and Electronics Engineers (IEEE), Oct 2018.
The definitive version is available at https://doi.org/10.1109/TEMC.2017.2782713
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Sponsor(s)
National Science Foundation (U.S.)
Keywords and Phrases
Ball grid arrays; Cavity resonators; Current density; Electric conductors; Electric impedance; Electronics packaging; Extraction; Frequency modulation; Inductance; Semiconductor device testing; Soldered joints; Cavity method; Equivalent inductance; Finite element method simulation; Modal expansion; Parallel plates; Power Distribution Network Design; Power integrity; Proximity effects; Finite element method; Analytical solution; Application-specified integrated circuit (ASIC) package; Ball grid array (BGA); Equivalent ball inductances; Parallel plate impedance
International Standard Serial Number (ISSN)
0018-9375; 1558-187X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Oct 2018
Comments
This work was supported in part by the National Science Foundation under Grant IIP-1440110.