A Novel Non-Isolated High-Gain DC-DC Boost Converter
Abstract
In this paper, a novel interleaved boost converter topology is introduced. The proposed converter is based on a combination of two types of voltage multiplier cells (VMC): Dickson and Cockroft-Walton (CW) voltage multiplier. Connecting VMCs to an interleaved boost stage yields many benefits, including smaller ripples on the input current, reduced voltage stress across switches and capacitors, and high overall voltage gain. These advantages allow designers to design high gain dc-dc converters with low-rated and highly efficient semiconductor components. Moreover, the use of VMC can reduce the requirements of the required energy storage and also allow to design with smaller capacitors than the conventional boost converter. This paper presents the analysis of steady state voltage gain, the design of the converter, selection of the components, and simulation of the voltage and current stresses across switches and storage elements. Also, A 200 W prototype was implemented to convert 20 to 400 Vdc. The implementation details and major waveforms are included and illustrated.
Recommended Citation
A. Alzahrani et al., "A Novel Non-Isolated High-Gain DC-DC Boost Converter," Proceedings of the 49th North American Power Symposium (2017, Morgantown, WV), pp. 1 - 6, Institute of Electrical and Electronics Engineers (IEEE), Sep 2017.
The definitive version is available at https://doi.org/10.1109/NAPS.2017.8107216
Meeting Name
49th North American Power Symposium (2017: Sep. 17-19, Morgantown, WV)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Intelligent Systems Center
Keywords and Phrases
Electric Inverters; Gain Measurement; Power Converters; Boost; Cockroftwalton; DC-DC; Dickson; High Gain; Interleaved; DC-DC Converters; Inductors; Capacitors; Stress; Steady-State; Switches; Integrated Circuits; DC-DC Power Convertors; Voltage Multipliers; High-Gain
International Standard Book Number (ISBN)
978-1538626993; 978-1538627006
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Sep 2017