Surface Impedance Approach to Calculate Loss in Rough Conductor Coated with Dielectric Layer


The analysis presented herein contains closed-form analytical expressions to calculate attenuation in a layered structure "rough metal-dielectric-dielectric", which is a practically important problem in separating dielectric loss from rough conductor loss in actual PCB stripline geometries, when measuring dielectric constant (Dk) and dissipation factor (Df) using travelling wave S-parameter methods. This approach is based on the surface impedance concept. It is shown that the presence of an epoxy layer on the conductor may affect extracted dielectric parameters, of a PCB substrate, especially the Df data.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2010: Jul. 25-30, Fort Lauderdale, FL)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Analytical Expressions; Closed Form; Conductor Loss; Dielectric Constants; Dielectric Layer; Dielectric Parameters; Dissipation Factors; Epoxy Layers; Layered Structures; S Parameters; Strip Line; Surface Impedances; Travelling Waves; Electromagnetic Compatibility; Electromagnetism; Organic Pollutants; Polychlorinated Biphenyls; Scattering Parameters; Dielectric Losses; Surface Impedance, Dielectrics; Surface Roughness; Corrugated Surfaces; Conductors; Impedance; Permittivity; Printed Circuit Design; Epoxy Layer; Rough Conductor; Rough Metal-Dielectric-Dielectric Structure; Dielectric Loss; PCB Stripline Geometries; Dielectric Constant; Dissipation Factor; Travelling Wave S-Parameter Method

International Standard Book Number (ISBN)

978-1424463053; 978-1424463084

International Standard Serial Number (ISSN)

2158-1118; 2158-110X

Document Type

Article - Conference proceedings

Document Version


File Type





© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2010