Power Delivery Effectiveness of Individual Power Planes in a Multiple Power Plane Pair Configuration Printed Circuit Board

Abstract

Multiple plane pair are employed in the power distribution network to ensure the required charge supply and reduce the overall voltage drop. The plane pair at the same voltage levels, thought, are located at different distances with respect to the top of the board, where the active devices are located. Hence, the supply of charges is not expected to be equally distributed among the different pair and the contribution to the charge delivery from the farther away plane pair is going to be limited by the value of the interconnect inductance, i.e., the farther away the plane, the larger the inductance, the lower the contribution to the charge delivery. The performance of various multi-plane pair configurations are investigated in this article by means of 3D full wave simulations as well as frequency and time domain simulations within a SPICE based tool.

Meeting Name

39th International Symposium on Microelectronics (2006: Oct. 8-12, San Diego, CA)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Cavity Model; Frequency And Time Domains; Full-Wave Simulations; Interconnect Inductance; Multiple Plane Pair; Power Delivery; Power Distribution Network; Voltage Levels; Inductance; Microelectronics; Three Dimensional Computer Graphics; Time Domain Analysis; Electric Power Transmission; Cavity Models; Power Delivery Effectiveness

International Standard Book Number (ISBN)

978-0930815806

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2006 International Microelectronics Assembly and Packaging Society, All rights reserved.

Publication Date

01 Oct 2006

This document is currently not available here.

Share

 
COinS