Impedance of an Infinitely Large Parallel-Plane Pair and Its Applications in Engineering Modeling
In this paper, a closed-form expression for the impedance of an infinitely large parallel plane pair is presented. It is applicable to practical printed circuit board (PCB) design problems where there are multiple shorting vias around the signal vias of interest. With the presence of multiple shorting vias, reflections from the plane pair edges can be neglected since the shorting vias prevent the electromagnetic energy from leaking away from the local cavity around the signal vias. The self and transfer impedance expressions can be obtained using the expansion of cylindrical waves. The impedances calculated from both the rectangular cavity model and the infinitely large plane pair model for several design examples are compared to demonstrate the effectiveness of the infinite plane pair approximation.
A. R. Chada et al., "Impedance of an Infinitely Large Parallel-Plane Pair and Its Applications in Engineering Modeling," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2009, Austin, TX), pp. 78-82, Institute of Electrical and Electronics Engineers (IEEE), Aug 2009.
The definitive version is available at https://doi.org/10.1109/ISEMC.2009.5284626
IEEE International Symposium on Electromagnetic Compatibility (2009: Aug. 17-21, Austin, TX)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Closed-Form Expression; Cylindrical Wave; Electromagnetic Energy; Engineering Modeling; Infinite Plane; Pair Approximation; Parallel Planes; Printed Circuit Board Designs; Rectangular Cavity; Transfer Impedance; Electromagnetic Compatibility; Electromagnetic Waves; Electromagnetism; Plastic Molds; Printed Circuit Design; Printed Circuit Manufacture; Printed Circuit Boards
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Article - Conference proceedings
© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2009