ESD Susceptibility Evaluation on Capacitive Fingerprint Module
This paper reports on an investigation of ESD stresses on a fingerprint module. It shows that sparking to the flex connector, dielectric breakdown of the insulating layers, and transient electric and magnetic fields can cause damage. Test methods and simulation models are shown. An ESD generator and ESD field probe were used to expose the fingerprint module to currents and electromagnetic fields. Breakdown of the top insulating layer was observed. Damage due to ESD induced H-field injection occurred A 1 kΩ resistively grounded ring is proposed as an ESD protection solution for the fingerprint module system. Its effect on the discharge current is shown via simulation.
P. Wei et al., "ESD Susceptibility Evaluation on Capacitive Fingerprint Module," Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (2017, Washington, DC), pp. 175-180, Institute of Electrical and Electronics Engineers (IEEE), Aug 2017.
The definitive version is available at https://doi.org/10.1109/ISEMC.2017.8077862
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (2017: Aug. 7-11, Washington, DC)
Electrical and Computer Engineering
Keywords and Phrases
Electric Discharges; Electric Equipment Protection; Electromagnetic Compatibility; Electromagnetic Fields; Electrostatic Discharge; Electrostatic Generators; Insulating Materials; Probes; Testing; Discharge Currents; Electric and Magnetic Fields; ESD Protection; Field Injection; Fingerprint Module; Insulating Layers; Module Systems; Susceptibility Evaluations; Electrostatic Devices; ESD Probes
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Article - Conference proceedings
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01 Aug 2017