Multiple Loaded Scatterer Method for E-Field Mapping Applications
Abstract
Spatial mapping of electric field distribution is an important objective in many applications including antenna pattern, radar cross-section, and specific absorption rate measurements. Modulated scatterer technique (MST) based on small loaded dipoles has been successfully used for these purposes for many years. However, MST suffers from several inherent limitations. These limitations become more severe as the frequency increases. This paper introduces a new and efficient method based on a multiple loaded scatterer (MLS) approach. The proposed method allows for accurate recovery of an unknown incident electric field with measurements conducted at a single observation point. The formulation of the MLS method along with several key simulation results illustrating its efficacy for electric field distribution measurement is presented. In addition, the results of several comparisons with conventional MST are also provided.
Recommended Citation
M. A. Abou-Khousa and R. Zoughi, "Multiple Loaded Scatterer Method for E-Field Mapping Applications," IEEE Transactions on Antennas and Propagation, vol. 58, no. 3, pp. 900 - 907, Institute of Electrical and Electronics Engineers (IEEE), Mar 2010.
The definitive version is available at https://doi.org/10.1109/TAP.2009.2039302
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Antenna Pattern; E-Field; Efficient Method; Electric Field Distributions; Electric Field Mapping; Inherent Limitations; Loaded Dipole; Modulated Scatterer; Observation Point; PIN Diode; Simulation Result; Spatial Mapping; Specific Absorption Rate; Directional Patterns (Antenna); Electric Field Measurement; Electric Fields; Mapping; Radar Cross Section; Semiconductor Diodes; Scattering; Modulated Scatterer Technique (MST); Multiple Loaded Scatterer (MLS)
International Standard Serial Number (ISSN)
0018-926X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Mar 2010