Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-Layer Backplane Board
Signal via transition is inevitable in backplane multi-layer board for high density routing. And a significant simultaneous switching noise (SSN) coupling to a signal occurs through the signal via transition. In this paper, we present suppression method of the SSN noise coupling caused by via transition in multi-layer backplane board using electromagnetic bandgap (EBG) structure. EBG structures are vertically located around a signal via to provide the low power/ground impedance area. The low power/ground impedance area suppresses the noise propagation and reduces the SSN noise coupling. It is shown that, within the stopband, the power/ground impedance at the position of the signal via with EBG structures is free from the power/ground planes cavity resonance, and the SSN coupling in single-ended and differential signaling is suppressed.
C. Hwang et al., "Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-Layer Backplane Board," Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility (2009, Zurich, Switzerland), pp. 197-200, Institute of Electrical and Electronics Engineers (IEEE), Jan 2009.
The definitive version is available at https://doi.org/10.1109/EMCZUR.2009.4783424
20th International Zurich Symposium on Electromagnetic Compatibility (2009: Jan. 12-16, Zurich, Switzerland)
Electrical and Computer Engineering
Keywords and Phrases
Periodic structures; Electromagnetic interference; Backplanes; Metamaterials; Impedance; Noise reduction; Routing; Electromagnetic coupling; Electromagnetic propagation; Resonance
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
16 Jan 2009